STM nitrogen making machine
SMT nitrogen machine combines the characteristics of lead-free soldering in SMT industry. Its purity is generally between 99.9% and 99.999%. The flow rate of nitrogen equipment matched with each welding furnace is generally 10-30Nm3/hr (calculated according to the actual flow rate of special specifications). The dew point is - 40 ~60 C, and the nitrogen pressure is about 0.5-0.6MPa. Solution of SMT special nitrogen gas can ensure correct activation of flux, reduce residual flux, enhance welding quality and make welding surface more beautiful.
Nitrogen demand in lead-free electronic assembly:
1) When using high temperature solder paste or low solid, low activity (no cleaning, low residue) solder paste;
2) When brazing more expensive integrated circuit components, small volume components, fine spacing components, flip chip and non-retrofittable components;
3) Multiple reflux of PCB with OPS coating during assembly or brazing;
4) Brazing of unprotected copper pads or PCBs with long storage time or reliability first。
Nowadays, lead-free production in the global electronic manufacturing industry is beginning. In order to meet the lead-free standard, more and more manufacturers choose new reflow soldering furnaces with nitrogen welding protection.